• 목록
• 답변
• 게시판 리스트 옵션
  • 수정
  • 삭제

For chromium plating a most well-liked answer composition, in ounces per gallon water, is as follows: chromic acid, 53; fluosilicate, 0.8; and sulfate, 0.13. For plating with this bath a temperature from room temperature to 95° F., a voltage from 6 to 12 and a current density from 50 to seven hundred amperes per square foot can be utilized. Suitable etchants for the preferred film supplies are as follows: "Teflon FEP," a sodium aryl resolution containing butyl alcohol and accessible commercially as "Gore Tetraetch"; Kapton, an aqueous answer of sodium hydroxide having a normality of 15 to 20; Mylar, an aqueous phosphoric acid resolution having a concentration of eighty to eighty five %. Previously recognized electroless copper-plating baths can be used, an example of an acceptable bath composition in grams per liter of water, being as follows: copper sulfate, 29; sodium carbonate, 25, Rochelle salt, 140; "Versene-T" (sodium salt of ethylenediaminetetracetic acid), 17; sodium hydroxide, 40; and formaldehyde (37 % resolution), 150. For a bath of this composition, the working temperature is stored under 75° F., and preferably about 70° F. Copper is deposited from this bath at a fee of 0.008 inch per hour. Electroless plating is used to deposit a really thin conductive layer on the cable in order that a current will be applied to the floor within the electrolytic plating step, the majority of the shielding layer being deposited by electrolytic plating.

Preferred working situations are a temperature of 110° to 140° F, a cathode present density of 10 to 70 amperes per sq. foot, an anode present density of 20 to 100 amperes per square foot, and a tank voltage of two to 5 volts. In this step the cable is rendered cathodic by electrical contact with one electrode of an electrolytic plating apparatus in order that a potential is developed between the cable and an electrolytic plating bath containing the specified metallic in solution, the plating bath being involved with one or more anodes to which direct present is supplied. The terminals 12 have to be made as to permit resilient outward deflection of the contact arms without damaging the terminals. Referring to FIG. 1A, it will be noted that the connector 12 features a contact part 13 and a cable interface part 14, wherein the contact half 13 includes contact elements for electric connection to a corresponding connector, while the cable interface part 14 is supplied with two rows of terminals in electrical connection to the corresponding contact elements of the contact half 13, for connection of the cable assembly 15. The cable assembly 15, in flip, is formed of two flat cables 15a and 15b, and each cable forming the flat cables 15a and 15b is connected to a corresponding terminal by way of press contact achieved by connector housings 16a and 16b. It ought to be noted that each of the cables 15a and 15b lengthen within the direction of insertion of the connector cable 11A to a corresponding socket or connector.

The contact obtained by exposing only the thin edge of the conductor is highly effective and reliable. For this embodiment the shielded cable is prepared in the way described above, except that after software of shielding layer 15 the cable is minimize longitudinally alongside its edge to remove the portion of the shielding layer 15 which is involved with the outermost conductor 11a. Cutting the shielding layer exposes top and backside edges 20a and 20b, respectively, that are saved spaced apart from conductor 11a by insulating layer thirteen and 14, respectively. The composition of the shielding layer 15 is chosen to supply the specified shielding characteristics and functionality for software by plating. Where contact between the shielding layer and a number of ground conductors is desired, a portion of the surface of the conductor is exposed alongside the length of the cable previous to plating. This step is readily carried out by passing the cable by way of a tank containing the plating bath, a contact time of 2 to 3 minutes being adequate normally.

This therapy is carried out by contacting the insulating film with an etchant selected for its response with the particular movie materials, the movie having first been cleaned and degreased by typical means. The response circumstances within the floor treatment step should be managed rigorously to keep away from excessive dissolution or penetration of the film. The insulating movie is supplied at a thickness appropriate for the actual cable requirements, a thickness of 0.001 to 0.005 inch being suitable generally. Only a very thin shielding layer is required for effective shielding, a thickness of 0.0001 to 0.0005 inch being suitable typically. The insulating material for these layers will be the identical as for inner layers thirteen and 14. A thickness of 0.001 to 0.002 inch is enough for the outer layers most often, though thicker layers can be utilized. Thicker layers can be utilized by depositing larger quantities of metallic within the plating steps, but on the expense of greater weight and decreased flexibility. The bulk of the insulating material surrounding the conductors is offered by sheets of insulating movie which make up layers 13 and 14. The insulating movie may be any material having a sufficiently low dielectric constant for the particular cable requirement, and plastics akin to polyethylene terephthalate (Mylar), polyimides exemplified by "Kapton," and halogenated hydrocarbons exemplified by "Teflon FEP" and polytetrafluoroethylene are most well-liked for his or her favorable mechanical and thermal properties, according to good insulating qualities.

In the event you liked this post as well as you want to be given more info concerning flat cable i implore you to check out the web site.